Samsung Begins Operation of Worlds Largest Memory Fab, Line-16

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Samsung announced today that it has begun operations of its new Line-16 memory semiconductor fabrication facility, which will provide the industry’s largest production capacity. It also announced the start of mass production of the industry’s first double data rate-3 (DDR3) dynamic random access memory (DRAM) based on 20 nanometer (nm) class process technology, which offers significant improvements to productivity and reduces energy consumption. The announcements were made during a ceremony at Samsung’s Nano City Complex in Hwaseong, Gyeonggi Province, where the new Line-16 is located. Samsung also announced the world’s first mass production of 20nm-class 2 gigabit (Gb) DDR3 DRAM. The 20nm-class DDR3 DRAM promises the most advanced performance yet, a further improvement on the 30nm-class* DDR3 DRAM that Samsung introduced in July last year. The 20nm-class solution improves productivity by 50 percent and reduces energy consumption by up to 40 percent, therein providing the greenest DDR3 solution available.

Samsung 20nm DDR3

Samsung began construction of Line-16 in May 2010 and completed installation of equipment for clean rooms this May. Trial production began in June and the facility was made operational for mass production in August. Housed in a 12-story building, Line-16 is the industry’s most advanced and largest memory fabrication facility, with a combined workspace of approximately 198,000 square meters. Starting this month, Samsung began mass production of high-performance 20nm-class NAND flash memory chips, with a projected volume of more than 10,000 12-inch wafers monthly. Samsung plans to ramp up production of NAND flash memory to meet market demand, and will begin production of more advanced memory semiconductors with high density and performance using 10nm-class* process technology next year.

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