ProMOS uses low-cost TSOP packaging for DDR2 Memory Modules
In order to increase its penetration rate in the DDR2 market, ProMOS Technologies has stared producing TSOP (thin small outline package) DDR2 in addition to traditional BGA (ball grid array) packed DDR2, as TSOP packed DDR2 attains a relatively lower cost than traditional packaging, according to industry sources. I don’t like the fact that consumers will be tricked on this one as TSOP based DDR2 is not JEDEC approved and might cause issues when used on many platforms as they were designed off of JEDEC BGA reference designs. Companies will do anything to increase sales!
In addition to providing PC OEMs with JEDEC standard BGA packaged DDR2, ProMOS has also started packaging DDR2 in TSOP as TSOP?s production cost is lower than BGA, the sources indicated. As DRAM migrates from DDR to DDR2, the related packaging methods also advance. DDR chips are traditionally packed under TSOP while DDR2 uses BGA. The major difference between these two packages is the connective material to the IC substrate. Data being transferred via the pins on the TSOP packed chips use an electric circuit on the substrate, while FBGA chips have tiny solder balls on the underside to make contact. TSOP packaging comes with a smaller profile and is commonly used in small-outline DIMMs. Observers believe that TSOP packed DDR2 can stimulate sales in the spot market.
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