OCZ Technology Launches XTC Memory Heat Spreaders
OCZ Technology has some new patent-pending XTC (Xtreme Thermal Convection) Heatspreaders that allow increased ventilation and heat dissipation due to an innovative honeycomb design. The new design provides better air flow to the actual memory ICs. I’m starting to wonder why companies even put heat spreaders on memory modules these days. We have a thread going in the forums about the looks of these IC’s.
The unique design used in the XTC heatspreaders optimizes the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained. “Our goal is to get rid of the thermal load as quickly and efficiently as possible. A honeycomb perforation contour promotes the physical escape of hot air from the space in between the individual memory components, thus enhancing the performance of the high performance Gold GX series and preserving the life of the ICs and future parts to come.?
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