Micron launches family of mobile DDR devices
Micron today launched a family of mobile DDR devices that it claims offer an enhanced feature set that delivers aggressive power specifications, superior bandwidth performance, and increased reliability over standard DRAM. Micron expects to start selling the new mobile DDR line during the second half of 2005.
The new mobile DDR is already available in 128Mb in x16 and 512mB in x16 and x32 configurations and 256Mb devices are scheduled for launch in the second half of this year. The new family adopts a new architecture with Micron’s Endur-IC technology that is specifically designed for mobile systems. In addition to exceeding the JEDEC (Joint Electron Device Engineering Council) standard and offering unimpaired performance from -40 degrees up to +85 degrees Celsius, Micron claims improved stackability and customer confirmation that the new mobile DDR products offer the industry’s lowest standby current.
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