Intel Stratix 10 DX FPGA Pictured in South Korea

By Nathan Kirsch September 29, 2019

While we were in South Korea for the Intel memory and storage day we ran across this Intel Stratix 10 DX FPGA development board. Intel Stratix 10 DX FPGAs are the first FPGA devices to support Intel Ultra Path Interconnect (Intel UPI) for direct coherent connection to future select Intel Xeon Scalable processors.

The Intel Stratix 10 DX also includes PCIe Gen4 interface with up to x16 configuration at 16 GT/s and a brand new memory controller that support Intel Optane DC persistent memory. On the right hand side of the board you have six UPI connectors. Just to the left of those you have an 8-pin PCIe power connector along the top edge of the board. A littler further to the left you’ll find 10 DDR4 memory ICs that are soldered down to the board.

Other features of the Intel Stratix 10 series of FPGAs include 100 GB/second Ethernet connectivity, HBM2 memory stacks and quad-core ARM Cortex-A53 processor subsystems with peripherals.

More Intel STRATIX 10 details are available in the product announcement and product page.

Intel Stratix 10 DX Device Overview

Targeting high-performance acceleration applications, increasingly used in Data Center, Networking, Cloud Computing, and Test & Measurement markets, Intel Stratix 10 DX FPGAs feature hard intellectual property blocks supporting both coherent and non-coherent protocol interfaces.

A low latency, high performance coherent interface is achieved when connecting the FPGA to selected Intel Xeon Scalable Processors via Intel Ultra Path Interconnect (UPI), while the non-coherent interface takes advantage of any PCI Express (PCIe) Gen4 capable device.

In addition to supporting these interface protocols, the DX variant FPGAs also offer hard intellectual property blocks for 100 Gigabit Ethernet and DDR4 memory control, combined with a high-performance monolithic 14 nm FPGA fabric die, all inside a single flip-chip FBGA package. Select Intel Stratix 10 DX devices include an integrated quad-core 64-bit Arm Cortex -A53 hard processor subsystem (HPS) on the fabric die, or embedded 3D stacked High-Bandwidth (up to 512 GB/s) DRAM memory (HBM2) inside the package.

As part of the Intel Stratix 10 family, the DX variant devices feature other innovations such as the Intel Hyperflex core architecture, variable precision DSP blocks with hardened support for both floating-point and fixed-point operation, and advanced packaging technology based on Intel Embedded Multi-die Interconnect Bridge (EMIB).