Gigabyte GO OC 2010 North America Overclocking Championships

Hardware Setup

While Gigabyte was introducing sponsors the overclockers were busy altering the motherboards to prepare them for sub-zero cooling.

Others starting buy using insulating materials like clay and foam around the Intel LGA 1366 CPU socket to keep moisture from reaching the boards and shorting something out.

Tape was used on this board to block off components that this overclocker didn’t want di-electric grease to cover. He’ll tape off the board and then spray it down with the tube of grease that you see in the top right corner of the image above.

Some overclockers brought a number of LN2 and DICE tubes with them, so as the competition goes on they can change them as needed.

The LN2 tubes might not look that interesting on the outside, but on the inside you can see that some thought and a ton of machining was needed to create the bottom plate!

Even the bottom of the motherboard needs to be protected and here we see G H Z taking measures to keep condensation from building up.

That hot glue gun that your grand parents use for silly crafts can also be used to keep a board from getting fried.

Using putty was the most used method here at GO OC 2010.

Here we see Gomeler running -90C on his Intel Core i7 980X processor trying to get the best PiFast score.

While the overclockers were inside doing the overclocking thing, the sponsors and models found removable tattoos. As you can imagine when you get bored you do silly things and the picture above captures one of those instances.