Intel To Announce Addition of USB 3.0 Sooner Than Expected
As AMD is already preparing to integrate USB 3.0 into its future chipset designs, Intel is expected to announce the addition of a USB 3.0 host controller into its Cougar Point motherboard reference design at Intel Developer Forum (IDF) 2010 in the US, according to a Chinese-language Commercial Times report. The announcement is expected to speed up the standardization of USB 3.0 and benefit USB 3.0 chip makers, the paper added. From the sounds of it Intel will be using third party controllers on their motherboards until they can release chipsets with USB 3.0 integrated inside. It remains unknown when a native USB 3.0 chipset will be announced, but the Intel Developer Forum is happening next week and it will likely be made known there.
SuperSpeed USB brings significant performance enhancements to the ubiquitous USB standard, while remaining compatible with the billions of USB enabled devices currently deployed in the market. SuperSpeed USB will deliver 10x the data transfer rate of Hi-Speed USB, as well as improved power efficiency.
- SuperSpeed USB has a 5 Gbps signaling rate offering 10x performance increase over Hi-Speed USB.
- SuperSpeed USB is a Sync-N-Go technology that minimizes user wait-time.
- SuperSpeed USB will provide Optimized Power Efficiency.No device polling and lower active and idle power requirements.
- SuperSpeed USB is backwards compatible with USB 2.0. Devices interoperate with USB 2.0 platforms. Hosts support USB 2.0 legacy devices.
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