TSMC to break ground for solar fab in September
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Taiwan Semiconductor Manufacturing Company (TSMC) plans to break ground for the construction of a new fab at the Central Taiwan Science Park (CTSP) to produce thin-film solar PV modules, with volume production expected to kick off in 2011, according to Rick Tsai, head of the foundry’s new business division.
In addition, TSMC is scheduled to begin equipment move-in for its LED fab at the Hsinchu Science Park in September, said Tsai. Construction on the facility began in March. Tsai noted that TSMC is looking to hire 500-600 staff, mostly R&D-focused engineers, for its new businesses over the next 12 months. TSMC’s board of directors recently approved plans to allocate US$319.6 million to develop the company’s new businesses.
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