GLOBALFOUNDRIES Expands Worldwide Manufacturing Capacity

By Nathan Kirsch

GLOBALFOUNDRIES today announced plans to expand its global semiconductor manufacturing operations with a series of new projects across its 300mm operations designed to support expected increases in both near-term and long-term customer demand. These projects consist of two major new initiatives:

  • The construction of an additional wafer manufacturing facility at Fab 1 in Dresden designed to add additional 45/40/28nm capacity and increase overall output to 80,000 wafers per month once fully ramped
  • Expanding the clean room shell currently under construction at Fab 8 in New York to provide the option to increase capacity at 28/22/20nm and bring overall site output up to 60,000 wafers per month once fully equipped

Our 300mm fabs have been consistently ranked among the most advanced and efficient in the industry, said Chia Song Hwee, chief operating officer, GLOBALFOUNDRIES. Now we are taking our heritage of lean foundry manufacturing and world-class fab performance and making it available on a broader scale to meet the demands of the worlds leading chip design companies. With this aggressive capacity build-out plan, we are well positioned to provide new and existing customers with the fastest option to get advanced products to market in the volumes they need to ensure success.

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