TSMC Announces Move to 20nm Process
Taiwan Semiconductor Manufacturing Company, Ltd. announced today at its 2010 Technology Symposium that it will skip the 22nm manufacturing process node and move directly to a 20nm technology. The move is value driven to make advanced technology a more viable alternative for its customers. The technology will be based on a planar process with enhanced high-K metal gate, novel strained silicon, and low-resistance copper Ultra-Low-K interconnects.
During his address to nearly 1,500 TSMC customers and third party alliances, Dr. Shang-yi Chiang, TSMC Senior Vice President, Research & Development, said that the move to 20nm creates a superior gate density and chip performance to cost ratio than a 22nm process technology and makes it a more viable platform for advanced technology designers. He also announced that TSMC is expected to enter 20nm risk production in the second half of 2012.
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