VIA Announces the EPIA-T700 – First Mobile-ITX Module
VIA Technologies today announced the VIA EPIA-T700: the first product based on the recently announced Mobile-ITX form factor. Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a uniquely compact computer-on-module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications.
The VIA EPIA-T700 can be used with a variety of carrier boards that can be adapted and customized to meet the needs of a range of applications and is powered by a specially miniaturized 1GHz VIA Eden ULV processor and the compact VIA VX820 MSP that together offer industry-leading I/O flexibility in the most compact of available form factors. The VIA EPIA-T700 features 512MB of DDR2 on-board system memory, meaning compatibility and reliability are guaranteed.
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