VIA Mobile-ITX form factor is 50% smaller than Pico-ITX
VIA Technologies today announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices. Mobile-ITX defines a uniquely compact 6cm x 6cm computer-on-module specification designed to enable an easier and less resource intensive development cycle for a range of ultra-compact, portable embedded systems. Shown below is an image of the Mobile-ITX reference design module, compared with a feather.
Extending VIAs reputation as a leading innovator and creator of ultra-compact form factors, Mobile-ITX at 6cm x 6cm, is currently the most compact computer-on-module form factor on the market, an incredible 50% smaller than the successful VIA-developed Pico-ITX form factor. Mobile-ITX employs a modularized design that includes a CPU module card and an I/O carrier board. This offers greater flexibility for developers who can simply drop in the CPU module to a custom designed, application specific carrier board, negating lengthy developmental design and testing phases.
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