Cooler Master V4 GT CPU Cooler Will Use Horizontal Vapor Chamber
After releasing the world’s first heatpipe heatsink in 2000, and the first vertical vapor chamber Heatsink in early 2012, Cooler Master today announces broader adoption of Vapor Chamber Technology developed by Cooler Master’s OEM and industrial cooling division in its retail Heatsinks. After the success of the TPC812 pioneering the use of modern vertical vapor chambers, Cooler Master is expanding the TPC series and will equip selected Models of the V series with Horizontal Vapor Chambers. The first Cooler Master Heatsink equipped with a horizontal vapor chamber, the V4 GT, will be officially released to the market in Q3, 2012. We asked Cooler Master for pricing, but we did not receive an answer this afternoon.
Horizontal Vapor Chambers spread Heat 8x faster than solid copper, eliminating hot spots and spreading heat evenly across the base of a heatsink. Since the vapor chamber effectively increases the heatpipe contact area, it allows the use of a larger number of heatpipes. Overall Horizontal Vapor Chambers enable faster and more efficient transfer of heat from the CPU to the heatpipes and fins, resulting in lower temperatures and slower, less noisy fans.
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