Announcing the 2012 Common Platform Tech Forum
IBM, Samsung, and GLOBALFOUNDRIES will preview the future of silicon technology at the 2012 Common Platform Technology Forum to be held at the Santa Clara Convention Center on March 14. The companies will address next-generation semiconductor innovation and discuss the Common Platforms technology – covering critical topics such as 28-, 20- and 14-nanometer processes, as well as innovations beyond 14nm and 450mm wafer manufacturing. You can register for the one-day event here.
The Common Platform alliance is built upon an unmatched legacy of invention and deep commitment to research and development from IBM. The combined expertise of the companies involved is driving truly breakthrough technology innovations for semiconductor manufacturing. Our focus on building the most extensive and open ecosystem around our core manufacturing capabilities delivers customers a flexible and risk-free way to bring a wide range of semiconductor products to market, said Michael Cadigan, general manager of IBM Microelectronics, on behalf of the Common Platform alliance.
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