IBM and GLOBALFOUNDRIES Announce Manufacturing Agreement
IBM and GLOBALFOUNDRIES two heavy weights in the world of technology today have just announced an agreement to jointly manufacture advanced computer chips. The companies will be producing the chips at there semiconductor fabs in New York’s “Tech Valley”. The new chips are based on IBM’s 32nm Silicon-on-Insulator (SOI) technology which was jointly developed with GLOBALFOUNDRIES among other members of IBM’s Process Development Alliance. The new products have just recently begun initial production at IBM’s 300mm fab in East Fishkill and GLOBALFOUNDRIES’ Fab 8 in Saratoga County. The two tech giants plan to ramp up to volume production in the second half of 2012.
Todays announcement is a natural extension of our longstanding partnership with IBM that includes production of 65nm and 45nm chips at our fabs in Singapore and Germany, said GLOBALFOUNDRIES CEO Ajit Manocha. With the addition of our newest factory in New York, we will now be jointly producing chips with IBM at four fabs on three continents.
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