Samsung Begins Mass Producing 30nm-class, 32-Gigabyte Memory
Samsung today announced that it is the first in the industry to start mass producing 32 gigabyte (GB) memory modules, essential for cloud computing and advanced server systems, using 30 nanometer (nm) class four gigabit (Gb) DDR3 DRAM chips. Samsungs 30nm-class 4Gb DDR3 chip offers an approximate 50 percent increase in productivity over a 40nm-class 4Gb DDR3, and as a result is expected to achieve rapid market penetration. Samsung started producing monolithic 4Gb DDR3 DRAM devices based on 30nm-class technology in February, which is only one year after it started producing 40nm-class 4Gb DDR3 DRAM devices. Just two months later, it began to provide 16GB modules to a number of server system manufacturers. Samsung expects to have more than 10 percent of its total DRAM chip production in 2012 at the 4Gb (or higher) density.
With this module, Samsung has secured the highest level of product and solution competitiveness in the DRAM market for PC, server and mobile applications, said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. We also plan to ship more energy-efficient 4Gb DDR3 DRAM based on 20nm-class* process technology in the second half of this year, which will significantly expand the rapidly growing market for green IT memory solutions. Moreover, we intend to keep delivering the greenest memory products with optimal performance for customers, he added.
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