AMD Announces 5.5W TDP Embedded G-Series APUs
AMD today announced immediate availability of two new AMD Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts, up to a 39 percent power savings compared to earlier versions1. The very low power consumption and small 361mm package is ideal for compact, fanless embedded systems like digital signage, kiosks, mobile industrial devices and many of the new emerging industry-standard small form factors such as Qseven. This is an unprecedented low-power offering for the embedded market that features one or two low-power x86 Bobcat CPU cores and a discreet class DirectX 11-capable GPU on a single die.
We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement, said Buddy Broeker, director, Embedded Solutions, AMD. System designers can now unleash their creativity without being constrained by heat or size issues.
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