50% of AMD’s HSF’s will use heatpipes in 2H 2005
Heat sinks that are used to cool your have not changed much the past few years, but that is about to change later this year. AMD has been slowly moving over to using HSF’s that utilize heat-pipes to better channel heat away from the processor. Digitimes is reporting that 50% of the cooling solutions that AMD ships out with new CPU’s will feature heat-pipes.
Heat-pipe cooling solutions will account for 50% of PC products based on Advanced Micro Devices (AMD) CPUs in the second half of this year, up from 10% in the first half, according to thermal solution providers Asia Vital Components (AVC).
For those PC vendors and manufacturers that mainly promote AMD processors, an increasing proportion are adopting heat-pipe cooling solutions, said AVC. AMD?s dual-core processors already feature power consumption of 110-120 watts, compared to 95-105 watts for its single-core processors.
In addition, AVC anticipates that 10% of Intel-based PC CPUs will use heat-pipe cooling solutions this year, up from about 5% in 2004.
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